Single head dual-platform solder mask adhesive dispensing machine

Automatic glue dispensers from TBT-TECH Dispensing Systems streamline adhesive application across diverse production processes-including bonding, filling, coating, sealing, dripping, and linear/arc/circular dispensing. Engineered to replace manual operations, our equipment eliminates human error, ensures consistent glue output, and boosts production efficiency while reducing material waste.

At the core of our offerings is seamless integration between advanced adhesive dispensing modules and precision XYZ-axis motion control. This synergy delivers exceptional dispensing accuracy with a repeat positioning precision of ±0.02mm, meeting the rigorous demands of high-precision manufacturing. Our product lineup covers epoxy dispensing modules, AB glue applicators, and fully automated liquid dispensing robots-all featuring intuitive teach pendant operation that simplifies programming, even for complex dispensing paths.

Designed for versatility, our dispensers are compatible with a broad spectrum of adhesive materials: silicone, AB adhesives, epoxy compounds, hot-melt glue, clear coatings, solder mask adhesive, and more. This adaptability makes them ideal for key sectors including electronics (PCB conformal coating, component bonding), home appliances (sealing of casings and components), automotive (motor controller potting, sensor assembly), medical devices (biocompatible glue application), and new energy (lithium battery pack structural bonding).

What sets TBT-TECH apart is our commitment to tailored solutions. We understand that no two production lines are identical-whether you need a compact desktop dispenser for small-batch electronics manufacturing, a high-speed inline system for mass-produced home appliances, or a custom robotic setup for specialized automotive components. Our team collaborates closely with you to assess your workflow, adhesive requirements, and precision needs, delivering a dispensing solution that integrates seamlessly with your existing production processes.

Backed by reliable after-sales support, including installation guidance, operator training, and timely maintenance services, BBA Dispensing Systems empowers manufacturers to enhance product quality, reduce labor costs, and stay ahead in competitive markets.

Contact us to get solutions.

Equipment Parameters

Model	TBT5331-SD
Maching Size	L824W613H661mm
Working Range	X: 500mm, Y1: 300mm, Y2: 300mm, Z: 100mm
Maximum Moving Speed	X, Y 600-800mm/s, Z 400mm/s
Repeated accuracy	士0.02mm
Working Valtage	AC220V/110V 50-60Hz
Working Air Pressure	0.4 to 0.8 Mpa
Drive Method	Motor + synchronous belt + linear guide
Files Storage	Around 1000 files
Programming Mode	Teach Pendant
Dispensing Path	Dot/Line/Arc/Circle
Working environment	-5~40℃, humidity 20%~95%

Equipment features

Single dispensing head with high-precision needle control, ensuring consistent glue output and ±0.02mm repeat positioning accuracy.
Dual alternating work platforms enable simultaneous loading/unloading and dispensing operations, maximizing production efficiency by reducing idle time.
Syringe-based glue supply system supports quick glue replacement, compatible with various adhesives (solder mask adhesive, UV glue, epoxy resin, etc.).
Compact desktop design saves workspace, with adjustable platform size to fit different workpiece dimensions (e.g., PCB boards, small electronic components).
Equipped with anti-dripping and glue suck-back functions, preventing glue waste and ensuring clean dispensing lines.
Intuitive touchscreen operation with programmable dispensing paths (point, line, arc, circle), supporting up to 100+ production process storage.
Stable servo motor drive for smooth movement, suitable for high-frequency repetitive dispensing tasks in electronics manufacturing.
Easy maintenance structure, with detachable syringes and nozzles for convenient cleaning and replacement of wearing parts.

The application industries of the Glue dispensing machine

Electronics manufacturing (PCB conformal coating, component bonding, semiconductor packaging)
Automotive industry (motor controller potting, sensor assembly, interior part bonding)
Home appliance production (casing sealing, wire fixing, component encapsulation)
Medical device manufacturing (biocompatible glue application, device sealing, catheter bonding)
New energy sector (lithium battery pack structural bonding, solar module potting)
Aerospace (lightweight component bonding, electronic system encapsulation)
Consumer electronics (smartphone camera module fixing, wearable device sealing)
LED lighting (phosphor dispensing, lamp bead bonding, housing sealing)

The applicable adhesives for the automatic glue dispensing systems

Epoxy resin (epoxy compounds, two-component epoxy glue)
Silicone (RTV silicone, thermal conductive silicone)
AB glue (two-component AB adhesive, structural AB glue)
Hot-melt glue (hot-melt adhesive, low-temperature hot-melt glue)
UV glue (UV-curable adhesive, UV conformal coating)
Conductive glue (electrically conductive adhesive, electromagnetic shielding glue)
Solder mask adhesive (PCB solder mask glue, anti-soldering adhesive)
Clear coating (transparent protective coating, acrylic clear glue)
Potting compound (thermal conductive potting glue, waterproof potting compound)